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310510 - ČSN EN 16602-70-08 - Zabezpečování kosmických produktů - Ruční pájení vysoce spolehlivých elektrických spojení | ||
| Název : 310510 - ČSN EN 16602-70-08 - Zabezpečování kosmických produktů - Ruční pájení vysoce spolehlivých elektrických spojení
Označení normy : ČSN EN 16602-70-08 Katalogové číslo : 97730 Třídící znak : 310510 Účinnost : 2015-10-01 Věstník : 2015.09 Strany : 106 Převzata :vyhlášením ve Věstníku - v angličtině TATO NORMA JE NEPLATNÁ | ||
| Cena : | 701.00 Kč (DPH= 0%), s DPH= 701.00 Kč | Nelze zakoupit |
| ANOTACE "ČSN EN 16602-70-08 This Standard defines the technical requirements and quality assurance provisions for the manufacture and verification of manually-soldered, high-reliability electrical connections. The Standard defines acceptance and rejection criteria for high reliability manufacture of manually-soldered electrical connections intended to withstand normal terrestrial conditions and the vibrational g-loads and environment imposed by space flight. The proper tools, correct materials, design and workmanship are covered by this document. Workmanship standards are included to permit discrimination between proper and improper work. The assembly of surface-mount devices is covered in ECSS-Q-ST-70-38. Requirements related to printed circuit boards are contained in ECSS-Q-ST-70-10 and ECSS-Q-ST-70-11. Verification of manual soldering assemblies which are not described in this standard are performed by vibration and thermal cycling testing. The requirements for verification are given in this Standard. This standard does not cover the qualification and acceptance of EQM and FM equipment with hand soldered connections. The qualification and acceptance tests of equipment manufactured in accordance with this Standard are covered by ECSS-E-ST-10-03. The mounting and supporting of components, terminals and conductors prescribed herein applies to assemblies designed to operate within the temperature limits of -55 st.C to +85 st.C. For temperatures outside this normal range, special design, verification and qualification testing is performed to ensure the necessary environmental survival capability. Special thermal heat sinks are applied to devices having high thermal dissipation (e.g. junction temperatures of 110 st.C, power transistors) in order to ensure that solder joints do not exceed 85 st.C. This standard may be tailored for the specific characteristic and constrains of a space project in conformance with ECSS-S-ST-00." | ||